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Ramli, M.I.I., Saud, N., Salleh, M.A.A.M., Derman, M.N. and Said, R.M. (2016) Effect of TiO2 Additions on Sn-0.7Cu-0.05Ni Lead-Free Composite Solder. Microelectronics Reliability, 65, 255-264.
https://doi.org/10.1016/j.microrel.2016.08.011

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