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Collins, M.N., Punch, J., Coyle, R., Reid, M., Popowich, R., Read, P., et al. (2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 1594-1600.
https://doi.org/10.1109/TCPMT.2011.2150223

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