TITLE:
Tensile Mechanical Behavior and Failure Mechanism of a Plain-Woven SiCf/SiC Composites at Room and Elevated Temperatures
AUTHORS:
Jianze He, Xuefeng Teng, Xiao’an Hu, Xiao Luo, Qi Zeng, Xueqiang Cao
KEYWORDS:
Plain-Woven, SiCf/SiC Composites, Damage and Failure Analysis, Stitching Hole
JOURNAL NAME:
Journal of Materials Science and Chemical Engineering,
Vol.12 No.4,
April
25,
2024
ABSTRACT: Ceramic matrix composites (CMCs) are the preferred materials for solving advanced aerospace high-temperature structural components; it has the comprehensive advantages of higher temperature (~1500˚C) and low density. In service environments, CMCs exhibit complex damage mechanisms and failure modes, which are affected by constituent materials, meso-architecture and inhere defects. In this paper, the in-plane tensile mechanical behavior of a plain-woven SiCf/SiC composite at room and elevated temperatures was investigated, and the factors affecting the tensile strength of the material were discussed in depth. The results show that the tensile modulus and strength of SiCf/SiC composites at high temperature are lower, but the fracture strain increases and the toughness of the composites is enhanced; the stitching holes significantly weaken the tensile strength of the material, resulting in the material is easy to break at the cross-section with stitching holes.