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Li, C., Vepari, C., Jin, H.-J., Kim, H.J. and Kaplan, D.L. (2006) Electrospun Silk-BMP-2 Scaffolds for Bone Tissue Engineering. Biomaterials, 27, 3115-3124.
https://doi.org/10.1016/j.biomaterials.2006.01.022

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