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Alim, M.A., Abdullah, M.Z., Aziz, M.S.A., Kamarudin, R. and Gunnasegaran, P. (2021) Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review. Polymers (Basel), 13, Article No. 3337.
https://doi.org/10.3390/polym13193337

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