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Lin, L., Tsai, Y.L. and Chou, T. (2011) Second-Level Interconnects Reliability for Large-Die Flip Chip Lead Free BGA Package in Power Cycling and Thermal Cycling Test. 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), Lake Buena Vista, 31 May-3 June 2011, 921-926.
https://doi.org/10.1109/ECTC.2011.5898622

has been cited by the following article:

• TITLE: Literature Review of Electronic Packaging Technology and Residual Stress

  AUTHORS: Wenji Ai, Shanshui Zheng, Xianfeng Zeng, Huibing Cheng

  KEYWORDS: Electronic Packaging Material, Residual Stress, Epoxy, Failure Mechanisms

  JOURNAL NAME: Open Journal of Applied Sciences, Vol.13 No.11, November 29, 2023

  ABSTRACT: The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search of a more reliable packaging material has become increasingly important. In the electronic packaging system, the failure phenomenon caused by residual stress is one of the key factors restricting the development of electronic packaging technology. In order to use the in-situ characterization technology to explore the residual stress inducing mechanism and failure mechanism of epoxy-based advanced packaging materials, this paper gives a review of related previous research, and lays a theoretical foundation for the upcoming research. The classification and generation mechanism of residual stress are clarified in this paper, which provides data support for future related research.