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Shohji, I., Yoshida, T., Takahashi, T. and Hioki, S. (2002) Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders. Materials Transactions, 43, 1854-1857.
https://doi.org/10.2320/matertrans.43.1854

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