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Lin, F., Bi, W.Z., Ju, G.K. and Wang, W.R. (2011) Evolution of Ag3Sn at Sn-3.0Ag-0.3Cu-0.05Cr/Cu Joint Interfaces during Thermal Aging. Journal of Alloys and Compounds, 509, 6666-6672.
https://doi.org/10.1016/j.jallcom.2011.03.134

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