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Gao, L.L., Xue, S.B., Zhang, L., Sheng, Z., Feng, J., Dai, W., Yu, S.L. and Zeng, G. (2010) Effect of Alloying Elements on Properties and Microstructures of SnAgCu Solders. Microelectronic Engineering, 87, 2025-2034.
https://doi.org/10.1016/j.mee.2010.04.007

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