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Ichitsubo, T., Matsubara, E., Fujiwara, K., Yamaguchi, M., Irie, H., Kumanoto, S. and Anada, T. (2005) Control of Compound Forming Reaction at the Interface Between SnZn Solder and Cu Substrate. Journal of Alloys and Compounds, 392, 200-205. https://doi.org/10.1016/j.jallcom.2004.09.043

has been cited by the following article:

• TITLE: Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys

  AUTHORS: Shihab Uddin, Md. Abdul Gafur, Mohammad Obaidur Rahman

  KEYWORDS: Lead-Free Solder, Strain Rate, Strain Sensitivity, Ductility, Tensile Properties

  JOURNAL NAME: Materials Sciences and Applications, Vol.14 No.4, April 13, 2023

  ABSTRACT: The tensile properties of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10-3 s-1, 20.85 × 10-3 s-1, and 208.5 × 10-3 s-1. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements.