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Cho, J.Y. and Szpunar, J.A. (2002) The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits. Materials Science Forum, 408-412, 1609-1614.
https://doi.org/10.4028/www.scientific.net/MSF.408-412.1609

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