TITLE:
Study of Copper Thin Films Resistivity by Using Van der Pauw Method at Low Frequencies
AUTHORS:
Désiré Allassem, B. Mahamout Mahamat, Adoum Kriga, Yaya Dagal Dari, Mahamat Hassan Béchir, Mahamat Ahmat Taha, Yacoub Nassian Nimir, Jean Pierre Chatelon, Jean-Jacques Rousseau
KEYWORDS:
Thin Film, Characterization, Van der Pauw, Resistivity, Thickness, LCRmeter
JOURNAL NAME:
Open Journal of Applied Sciences,
Vol.12 No.11,
November
29,
2022
ABSTRACT: The
objective of this work research is the use of four-point measurements and
so-called Van Der Pauw methods in measuring the resistivity of copper thin
films widely used in the manufacture of planar components such as inductor and
others. Aligned configuration and square configuration are commonly used to
measure thin films resistivity before use. But differences in values between the two configurations according
to frequency and thickness were observed
according to the authors. Measurements with both configurations on the same
thin films must make it possible to know measurements evolution as a function
of frequency and thickness. The observation of measuring frequency ranges of each configuration and the minimum thicknesses to have solid copper resistivity are
the main contributions of the paper. This electrical characterization is
carried out on copper thin films deposited on alumina substrates (50 mm × 20 mm × 635 μm) using RF sputtering technique. Copper
thin films with various thicknesses (3.3 μm, 3.6 μm and 5.2 μm) were
characterized. Low-frequency electrical characterization of these thin films
was performed by four-point measurement method and using an HP 4284A type
LCRmeter over the frequency range of 20 Hz to 1 MHz. Van der Pauw’s method was
used to calculate resistivity. These studies allowed us to know influence of
measurement configurations and influence of parameters such as frequency and
thickness of the copper thin films on resistivity.