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Qin, R.X., Wang, Q.P., Wang, Q.P., Chen, F.L. and Zhu, Z.Q. (2018) Research and Numerical Simulation of Thermal Conductivity of SiCp/6061Al Composite Fabricated by Pressureless Infiltration. Materials Research Express, 6, Article ID: 016525.
https://doi.org/10.1088/2053-1591/aae568

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