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Zhuang, Z., Hu, M., Wang, Y.N., Dai, R., Li, Q.L., Zhou, X.F., Wei, Y.Z. and Yang, L. (2017) ANSYS-Based Simulation Study on Heat Conduction of Dual-Frequency Microchip Lasers. Optical Communication Technology, 41, 42-45.

has been cited by the following article:

• TITLE: Thermal Analysis of an Antenna

  AUTHORS: Kuiyuan Shen, Guangyu Wang, Quan Wen

  KEYWORDS: Thermal Analysis Simulation, Heat Transfer

  JOURNAL NAME: Journal of Applied Mathematics and Physics, Vol.10 No.8, August 31, 2022

  ABSTRACT: In order to study the internal temperature changes and heat transfer phenomena of a model during external warming, a heat transfer simulation was conducted. The thermal analysis of the model was simulated by using ANSYS/LSDYNA software, and the heat and heat transfer phenomena of the warhead in the actual process were simulated by setting the temperature conditions on the surface of the model, and the model boundary and internal temperature changes were obtained from the simulation experiments, and relevant conclusions were drawn.