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Rebouillat, S., Steffenino, B., Lapray, M. and Rebouillat, A. (2020) New AI-IP-EI Trilogy Opens Innovation to New Dimensions; Another Chip in “the Innovation Wall”, What About Emotional Intelligence (EI)? Intelligent Information Management, 12, 131-182.
https://doi.org/10.4236/iim.2020.124010

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