TITLE:
Design and Research of a New Type of Ultrasonic Vibration De-Gluing Device
AUTHORS:
Zihao Liu, Zhen Yin, Jie Ying, Peng Zhang
KEYWORDS:
Ultrasonic Vibration, Epoxy Resin Adhesive, Finite Element Analysis, Ultrasonic De-Gluing
JOURNAL NAME:
World Journal of Engineering and Technology,
Vol.9 No.4,
November
29,
2021
ABSTRACT: In this paper, a new type of ultrasonic vibration de-gluing device has been designed to remove the cured epoxy resin adhesivethatoverflowed from the aluminum alloy structural parts in the high-speed train carriages. At present, manual removal is used to remove the cured epoxy resin adhesive that overflows at the bonding site. This method has low removal efficiency and leads to poor surface quality of the parts. The new type of ultrasonic vibration de-gluing device can solve these problems. Modal analysis and harmonic response analysis are carried out on the ultrasonic vibration oscillator system in the ultrasonic vibration de-gluing device, and the reasonable structure parameters and resonance frequency of the ultrasonic vibration oscillator system are determined. Finally, the impedance test and de-gluing effect test are carried out on the prototype of the ultrasonic vibration de-gluing device to verify the feasibility and practicability of the new type of ultrasonic vibration de-gluing device. The results show that the ultrasonic vibration de-gluing device’s stable resonant operating frequency is 28,270Hz, and the average error between the simulation and experimental results of the resonant operating frequency is less than 3%, which validates the simulation model.