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Gu, X., Turlapati, L., Dang, B., Tsang, C.K., Andry, P.S., Dickson, T.O., et al. (2011) High-Density Silicon Carrier Transmission Line Design for Chip-to-Chip Interconnects. 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, 23-26 October 2011, 27-30.
https://doi.org/10.1109/EPEPS.2011.6100177

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