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Joshi, M., Purwar, R., Wazed, A. and Rajendran, S. (2010) Antimicrobial Textiles for Health and Hygiene Applications Based on Eco-Friendly Natural Products. In: Anand, S.C., Kennedy, J.F., Miraftab, M. and Rajendran, S., Eds., Woodhead Publishing Series in Textiles, Medical and Healthcare Textiles, Woodhead Publishing, Cambridge, 84-92.
https://doi.org/10.1533/9780857090348.84
https://www.sciencedirect.com/science/article/pii/B9781845692247500108

has been cited by the following article:

• TITLE: A Comparative Study into the Engineering Properties of Neem Wood from Ghana

  AUTHORS: Gladys A. Quartey, John Frank Eshun, Emmanuel Attitsogbui

  KEYWORDS: Azadirachta indica, Modulus of Elasticity, Modulus of Rapture, Lesser-Known Wood, Structural Utilisation

  JOURNAL NAME: Materials Sciences and Applications, Vol.12 No.11, November 15, 2021

  ABSTRACT: A study into the mechanical properties of Neem wood was done to explore the possibility of its usage as a structural material. This paper presents the results of some investigations into the strength properties of Neem (Azadirachta indica A. Juss.) and compares them with those of Odum (Milicia excelsa) and European Oak (Quercus spp.) which are well known structural wood species in Ghana and Europe, respectively. The properties were determined using British (BS 373, 1957) and American timber testing specifications (ASTM D143, 1983) using testing methods for small, clear specimens of wood. The results showed that at 12% moisture content the wood has a density of 740 kg/m3 with a mean modulus of rupture of 8317 N/mm2, compressive strength parallel to the grain of 318.8 N/mm2, modulus of elasticity of 8644 N/mm2, and shear strength parallel to the grain of 17 N/mm2. The bending strength (MOR) of Neem is about 30% lower than that of Odum and about 2% higher than Oak. The modulus of elasticity of Neem is about 39% lower than Odum and 43% lower than Oak. The strength properties in the present work suggest that the wood of Neem has a potential for utilisation in structural applications.