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Wang, G.Y., Jiang, Z.H., Jiang, Q. and Lian, J.S. (2008) Mechanical Behavior of an Electrodeposited Nanostructured Cu with a Mixture of Nanocrystalline Grains and Nanoscale Growth Twins in Submicrometer Grains. Journal of Applied Physics, 104, Article ID: 084305.
https://doi.org/10.1063/1.2999379

has been cited by the following article:

• TITLE: Stabilization of Nanocrystalline Copper by Tantalum Grain Boundary Segregation

  AUTHORS: Sufeng Wei, Xinming Hu, Xianglei Liu, Guoyong Wang

  KEYWORDS: Nanocrystalline, Segregation, Creep, Nanoindentation, Grain Growth, Annealing

  JOURNAL NAME: Open Journal of Physical Chemistry, Vol.11 No.3, August 3, 2021

  ABSTRACT: Nanocrystalline Cu-Ta alloy films were deposited on glass slides by magnetron sputtering. Microstructure characterization proved that most of the tantalum atoms are segregated in the grain boundaries. Nanoindentation creep measurements were performed on it to uncover the stability mechanism of grain boundary segregation on nanocrystalline materials. It is found that segregation can effectively slow down the creep strain rate and the grain boundary activities. The suppressed grain boundary activities endow the alloy with a stable microstructure during plastic deformation and annealing.