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Park, Y.J., Lim, D.H., Kim, H.J., et al. (2009) UV- and Thermal-Curing Behaviors of Dual-Curable Adhesives Based on Epoxy Acrylate Oligomers. International Journal of Adhesion and Adhesives, 29, 710-717. https://doi.org/10.1016/j.ijadhadh.2009.02.001

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