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Sikka, K., Wakil, J., Toy, H. and Liu, H. (2012) An Efficient Lid Design for Cooling Stacked Flip-Chip 3D Packages. 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, 30 May-1 June 2012, 606-611.
https://doi.org/10.1109/ITHERM.2012.6231484

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