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Souare, P.M., Toure, M.K., Allard, S., et al. (2018) High Precision Numerical and Experimental Thermal Studies of Microelectronic Packages in Still Air Chamber Tests. 2018 7th Electronic System-Integration Technology Conference (ESTC), 18-21 September 2018, 1-8.
https://doi.org/10.1109/ESTC.2018.8546346

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