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Liu, Z., Swarup, S., Tan, S.X., Chen, H. and Wang, H. (2014) Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 33, 1490-1502.
https://doi.org/10.1109/TCAD.2014.2334321

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