Article citationsMore>>

Mizunuma, H., Lu, Y. and Yang, C. (2011) Thermal Modeling and Analysis for 3-D ICs with Integrated Microchannel Cooling. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 30, 1293-1306.
https://doi.org/10.1109/TCAD.2014.2334321

has been cited by the following article: