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Rzepka, S., Banerjee, K., Meusel, E. and Hu, C.M. (1998) Characterization of Self-Heating in Advanced VLSI Interconnect Lines Based on Thermal Finite Element Simulation. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 21, 406-411.
https://doi.org/10.1109/95.725203

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