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Ho, C.E., Chen, W.T. and Kao, C.R. (2001) Interactions between Solder and Metallization during Long-Term Aging of Advanced Microelectronic Packages. Journal of Electronic Materials, 30, 379-385.
https://doi.org/10.1007/s11664-001-0047-6

has been cited by the following article:

• TITLE: Inhibition Performance of Some Sulfonylurea on Copper Corrosion in Nitric Acid Solution Evaluated Theoretically by DFT Calculations

  AUTHORS: Mougo André Tigori, Amadou Kouyaté, Victorien Kouakou, Paulin Marius Niamien, Albert Trokourey

  KEYWORDS: Chlorpropamide, Tolazamide, Glipizide, Density Functional Theory, Copper Corrosion

  JOURNAL NAME: Open Journal of Physical Chemistry, Vol.10 No.3, August 3, 2020

  ABSTRACT: The theoretical study of chlorpropamide, tolazamide and glipizide was carried out by the Density Functional Theory (DFT) at B3LYP/6-31G(d) level. This study made it possible to determine the global reactivity parameters in order to better understand the interactions between the molecules studied and the copper surface. Then, the determination of local reactivity indices (Fukui functions and dual descriptor) on these molecules resulted in the precision on the most probable centers of nucleophilic and electrophilic attacks within each molecule. The results obtained, show that chloropropamide, tolazamide and glipizide can be good inhibitors against copper corrosion. Thus, the mechanism of copper corrosion inhibition of these compounds in nitric acid solution has been explained by means of theoretical calculations.