Article citationsMore>>

Wang, S.H., Wan, C.P., Heng, Y.X. and Ao, J.-P. (2019) Effect of Grinding-Induced Stress on Interface State Density of SiC/SiO2. Materials Science Forum, 954, 121-125. https://doi.org/10.4028/www.scientific.net/MSF.954.121

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top