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C. H. Weng, C. Z. Tsai, S. H. Chu and Y. C. Sharma, “Adsorption Characteristics of Copper (II) onto Spent Activated Clay,” Separation and Purification Technology, Vol. 54, No. 2, 2007, pp. 187-197. doi:10.1016/j.seppur.2006.09.009

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