TITLE:
Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel
AUTHORS:
Hasan Abbasinejad, Reza Hoseini Abardeh
KEYWORDS:
Forced Boiling, Electronic Cooling, Subcooled Boiling, Dry-Out
JOURNAL NAME:
Journal of Electronics Cooling and Thermal Control,
Vol.9 No.1,
March
31,
2020
ABSTRACT: This paper aims to model a subcooled flow boiling in a vertical stainless-steel micro-channel with an upward flow in 1 mm diameter, 40 mm length and 0.325 mm thickness tube. Water has been considered as a working fluid. The heat flux varies from 600 - 750 kW·m-2, input velocity from 1 - 2 m·s-1, and the subcooled temperature varies from 59.6 - 79.6 K. The working pressure and saturation temperature are 1 atm and 372.75 K, respectively. The results show that, the flow boiling keeps the temperature of the channel wall lower and more uniform than a single-phase flow, as long as the flow boiling does not reach the dry-out point. The onset point of dry-out depends on three factors, heat flux, inlet velocity, and subcooled temperature. In addition, the dry-out occurs at a point near the channel inlet with increased heat flux and subcooled temperature. Decreasing the inlet velocity would also cause the dry-out point to shift closer to the inlet of the channel.