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Park, H., Yoo, S., Ahn, H., Bang, J., Jeong, Y., Yi, M., Won, J.C., Jung, S. and Kim, Y.H. (2019) Low-Temperature Solution-Processed Soluble Polyimide Gate Dielectrics: From Molecular-Level Design to Electrically Stable and Flexible Organic Transistors. ACS Applied Materials & Interfaces, 11, 45949-45958.
https://doi.org/10.1021/acsami.9b14041

has been cited by the following article:

• TITLE: Epoxy Methacrylate Resin as Binder Polymer for Black Negative-Tone Photoresists

  AUTHORS: Genggongwo Shi, Kyeongha Baek, Seon Hong Ahn, Jun Bae, Jeseob Kim, Lee Soon Park

  KEYWORDS: Epoxy Methacrylate Resin, Negative-Tone Photoresist, Binder Polymer

  JOURNAL NAME: Materials Sciences and Applications, Vol.11 No.5, May 8, 2020

  ABSTRACT: Epoxy acrylate (EA) resin, which originates from epoxides, has long been served as a photocurable coating and adhesive material owing to its double bonds. Specifically, alkaline-developable EA resins can be used as a binder polymer in negative-tone photoresists. In this work, we synthesized a series of acidic polyester-type epoxy methacrylate resins, characterized the intermediates and products, and tested their performance as a binder polymer for the photolithographic micro-patterning of the pixel-defining layer on organic light-emitting diodes in comparison to a widely used commercial binder polymer. Copolymer-type binder polymer BP-2-2 was produced excellent patterning with no residue due to its high compatibility with the black mill base.