TITLE:
The Microstructure and Properties of Copper with Ceria Nanoparticles Addition
AUTHORS:
Daniela Passarelo Moura da Fonseca, Waldemar Alfredo Monteiro
KEYWORDS:
Copper-Based Composites, Ceria, Microstructure, Electrical Conductivity, Hardness
JOURNAL NAME:
Journal of Materials Science and Chemical Engineering,
Vol.7 No.10,
October
22,
2019
ABSTRACT: Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800°C for 6 h in vacuum atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.