Article citationsMore>>

D. T. Rooney, D. Nager, D. Geiger, and D. Shanguan, “Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds,” Microelectronics Reliability, Vol. 45, No. 2, pp. 379–390, 2005.

has been cited by the following article:

• TITLE: A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder

  AUTHORS: Ren-Jung Chang, Yu-Tsang Hsieh, Eric Chang

  KEYWORDS: Systematic Framework, Maintenance, Service, Wire Bonder, Failure Modes, Mechatronics, Axiomatic Design, Taguchi Method

  JOURNAL NAME: iBusiness, Vol.2 No.1, March 26, 2010

  ABSTRACT: A systematic framework for the maintenance and service of equipment is developed and proposed. The framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. With axiomatic design mapping, the maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method. The maintenance and service of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is employed for illustration