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G. G. Harman, “Wire bonding in microelectronics, material, processes, reliability, and yield,” 2nd edition, McGraw Hill, New York, 1997.

has been cited by the following article:

• TITLE: A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder

  AUTHORS: Ren-Jung Chang, Yu-Tsang Hsieh, Eric Chang

  KEYWORDS: Systematic Framework, Maintenance, Service, Wire Bonder, Failure Modes, Mechatronics, Axiomatic Design, Taguchi Method

  JOURNAL NAME: iBusiness, Vol.2 No.1, March 26, 2010

  ABSTRACT: A systematic framework for the maintenance and service of equipment is developed and proposed. The framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. With axiomatic design mapping, the maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method. The maintenance and service of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is employed for illustration