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Gao, Y., Mo, Q., Luo, Z., Zhand, L. and Huang, C. (2006) Atomic Bonding and Properties of Al-Cu Alloy with θ(Al2Cu). Journal of Electronic Materials, 35, 1801-1805.
https://doi.org/10.1007/s11664-006-0160-7

has been cited by the following article:

• TITLE: Microstructure and Strength of Diffusion Bonded 2014 AA Alloys Using Copper Interlayer

  AUTHORS: Abass Ali Saleh

  KEYWORDS: 2014 AA Alloys, Diffusion Bonding, Microstructure

  JOURNAL NAME: Open Journal of Applied Sciences, Vol.9 No.5, May 15, 2019

  ABSTRACT: The major awkwardness when joining AA2014 lies in the presence of creation of oxide films and brittle intermetallic in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. This paper reveals the characterization of diffusion connection of aluminum alloy AA 2014 with and without applying copper powder. Joining was achieved in vacuum up to (1 × 10-5 mbar) by means of vacuum system. Aluminum alloy AA2014 samples were done as cylinder form and interlayer thickness was equal 100 μm, under joining conditions of (325°C - 475°C) and 4 MPa and period of (1 hour). The ultimate strength was found equal to 188.36 MPa. Bonding joint was examined using light microscope, (SEM) with (EDS) for determining microstructure and depth of diffusion and microhardness was also used at connection zone. XRD outcomes display that the main intermetallic compound phase formula was Al2C. The maximum depth of diffusion obtained was 19.1 μm.