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I. Artaki, A. M. Jackson and P. T. Vianco “Evaluation of Lead-Free Solder Joints in Electronic Assemblies,” Journal of Electronic Materials, Vol. 23, No. 8, 1994, pp. 757-764. doi:10.1007/BF02651370

has been cited by the following article:

• TITLE: Synthesis of Sn-3.5Ag Alloy Nanosolder by Chemical Reduction Method

  AUTHORS: Hsin Jen Pan, Chao Yang Lin, Udit Surya Mohanty, Jung Hua Chou

  KEYWORDS: Alloy, Agglomeration, Nanoparticles, Chemical Reduction, Morphology, X-Ray Diffraction

  JOURNAL NAME: Materials Sciences and Applications, Vol.2 No.10, October 17, 2011

  ABSTRACT: The synthesis of Sn-3.5Ag alloy nanosolder was investigated by chemical reduction method. In this method, chemical precipitation was achieved by using sodium NaBH4 as a reducing agent and PVP (poly-m-vinyl 2- pyrrolidone) as a stabilizer. The experimental results obtained with different amounts of NaBH4 and PVP were compared. X-ray diffraction (XRD) patterns revealed that Ag3Sn was formed due to the successful alloying process. Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) demonstrated a change in the morphology of Sn-3.5 Ag alloy nanosolder with increase in the PVP content in the bath. The size of the nanoparticles ranged from 300 to 700 nm. The nanosolder/nanoparticles were thus synthesized successfully under controlled and optimized chemical reduction process.