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Araki, T., Sigahara, T., Jiu, J., Nagao, S., Nogi, M., Koga, H., Uchida, H., Shinozaki, K. and Suganuma, K. (2013) Cu Salt Ink Formulation for Printed Electronics Using Photonic Sintering. Langmuir, 29, 11192-11197.
https://doi.org/10.1021/la402026r

has been cited by the following article:

• TITLE: Preparation and Properties of Copper Fine Wire on Polyimide Film in Air by Laser Irradiation and Mixed-Copper-Complex Solution Containing Glyoxylic Acid Copper Complex and Methylamine Copper Complex

  AUTHORS: Tomoji Ohishi, Naoki Takahashi

  KEYWORDS: Glyoxylic Acid Copper Complex, CO2 Laser, Fine Copper Wire, Laser Direct Patterning, Polyimide Film, Printable Electronics

  JOURNAL NAME: Materials Sciences and Applications, Vol.9 No.11, October 11, 2018

  ABSTRACT: Formation of copper wiring on a polyimide film by laser irradiation to a stable copper-complex film consisting of glyoxylic acid copper complex and methylamine copper complex in air has been investigated. A stable metallic copper on the polyimide film was precipitated even in air. Since this copper was generated only in the laser-irradiated parts, direct patterning of copper wiring was possible. It was also found that copper was precipitated by electroless copper plating on the laser-deposited copper wiring and it was possible to thicken the copper wiring by this precipitation. The resistivity of the copper wiring was almost the same as that of the bulk of metallic copper. The developed method—combining laser irradiation to a copper-complex-coated film and electroless copper plating—enables the high-speed deposition of fine copper wiring on a polyimide film in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring without high vacuum facility and heat-treatment under inert gas.