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Tada, M., Park, J.H., Jain, J.R. and Saraswat, K.C. (2009) Low-Temperature, Low-Pressure Chemical Vapor Deposition and Solid Phase Crystallization of Silicon-Germanium Films. Journal of the Electrochemical Society, 156, D23-D27.
https://doi.org/10.1149/1.3008009

has been cited by the following article:

• TITLE: The Larger Grain and (111)-Orientation Planes of Poly-Ge Thin Film Grown on SiO2 Substrate by Al-Induced Crystallization

  AUTHORS: Shaoguang Dong, Junhuo Zhuang, Yaguang Zeng

  KEYWORDS: Al-Induced Crystallization, Poly-Ge Thin Film, Diffusion Control Interlayer, Lower Annealing Temperature

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.6 No.2, February 13, 2018

  ABSTRACT: Al-induced crystallization yields the larger grain and (111)-orientation planes of poly-Ge thin film grown on SiO2 substrate, the (111)-orientation planes of poly-Ge thin film grown on SiO2 substrate are very important for the superior performance electronics and solar cells. We discussed the 50 nm thickness poly-Ge thin film grown on SiO2 substrate by Alinduced crystallization focusing on the lower annealing temperature and the diffusion control interlayer between Ge and Al thin film. The (111)-orientation planes ratio of poly-Ge thin film achieve as high as 90% by merging the lower annealing temperature (325℃) and the GeOx diffusion control interlayer. Moreover, we find the lack of defects on poly-Ge thin film surface and the larger average grains size of poly-Ge thin film over 12 μm were demonstrated by electron backscatter diffraction measurement. Our results turn on the feasibility of fabricating electronic and optical device with poly-Ge thin film grown on SiO2 substrate.