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Bier, W., Keller, W., Linder, G., Seidel, D. and Schubert, K. (1990) Manufacturing and Testing of Compact Micro Heat Exchangers with High Volumetric Heat Transfer Coefficients. ASME, Dynamic Systems and Control Division, Dallas, 25-30 November 1990, 189-197.

has been cited by the following article:

• TITLE: A Comprehensive Review on Heat Transfer Design Parameters in MEMS through Experimentations and Numerical Modeling

  AUTHORS: Yasir M. Shariff

  KEYWORDS: Mems, Heat, Transfer, Design, Parameters

  JOURNAL NAME: Open Journal of Microphysics, Vol.8 No.1, February 9, 2018

  ABSTRACT: Micro electro mechanical systems are studied in this paper along to comparing the design, fabrication, and operation of such devices especially in the electronic industry. The advancements of such systems are important as scale reduction is becoming more economical and also in heat dissipation efficiencies. Furthermore, the fabrication techniques are becoming more of a challenge in today’s industrial market. In this paper we will introduce a comparative study of experimental research in the micro scale heat exchanger with varieties of industrial application primarily cooling integrated circuits. Significant effect in the process of cooling electronic devices has showed experimentally that scale variations impact into this improvement. Numerical studies have been a leading technique in the development of thermal systems especially at the micro or small scales which helps the industry to cut cost and provide innovative products at high efficiencies. There are so many approaches to numerical analysis and research, where the availability of ready to use software and data acquisition modules is variant. Material selection is also a variable in the efficiency and operations of these micro channel thermal system and heat exchangers.