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R. S. Sidhu and N. Chawla, “Three-Dimensional Microstructure Characterization of Ag3Sn Intermetallics in Sn- Rich Solder by Serial Sectioning,” Materials Characterization, Vol. 52, No. 8 ,2004, pp. 225-230. doi:10.1016/j.matchar.2004.04.010

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