Article citationsMore>>

M. McCormack, S. Jin, G. W. Kammlott and H. S. Chen, “New Lead-Free, Sn-Ag-Zn-Cu Solder Alloy with Improved Mechanical Properties,” Applied Physics Letters, Vol. 63, No. 1, 1993, pp. 15-17.

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top