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Liu, J.B., Zhang, L., Yao, D.W. and Meng, L. (2011) Microstructure Evolution of Cu/Ag Interface in the Cu-6 wt.% Ag Filamentary Nanocomposite. Acta Mater., 59, 1191-1197. https://doi.org/10.1016/j.actamat.2010.10.052

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