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Park, B.D., Kang, E.C. and Park, J.Y. (2006) Effects of Formaldehyde to Urea Mole Ratio on Thermal Curing Behavior of Urea-Formaldehyde Resin and Properties of Particleboard. Journal of Applied Polymer Science 101,1787-1792.
https://doi.org/10.1002/app.23538

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