Article citationsMore>>

Y. Zhou, C. S. Yang, J. A. Chen, et al. “Investigation of Young’s modulus and residual stress of copper film micro- bridges by MEMS technology,” Modern Scientific Instruments, Vol. 4, pp. 45, 2003.

has been cited by the following article:

• TITLE: Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force

  AUTHORS: Y. LIU, G.C. WANG, H.Y. YANG

  KEYWORDS: MEMS, Electrostatic Actuation, Multilayered Micro-Bridge, Trial Solution, Energy Method, Pull-In Voltage

  JOURNAL NAME: Engineering, Vol.2 No.1, January 27, 2010

  ABSTRACT: A trial solution for bending deflection of a multilayered micro-bridge subject to a voltage induced load is presented. The relation between the applied voltage and the displacements of the micro-bridge in the pull-in state is analyzed by energy method. Furthermore, two analytical expressions about normalized displacement and pull-in voltage are carried out. It’s proved that the value of normalized displacement is not influenced by residual stress if axial and shear deformation is ignored. Finally, the theoretical results are compared with that of FEM, and they show good agreement.