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Mizunuma, H., Lu, Y.-C. and Yang, C.-L. (2011) Thermal Modeling and Analysis for 3-D ICs with Integrated Microchannel Cooling. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., 30, 1293-1306. http://dx.doi.org/10.1109/TCAD.2011.2144596

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