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Brunschwiler, T., Michel, B., Rothuizen, H., Kloter, U., Wunderle, B., Oppermann, H. and Reichl, H. (2009) Interlayer Cooling Potential in Vertically Integrated Packages. Microsystem Technologies, 15, 57-74. http://dx.doi.org/10.1007/s00542-008-0690-4

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