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Gale, G.W., Rath, D.L., Cooper, E.I., Estes, S., Okorn-Schmidt, H.F., Brigante, J., Jagannathan, R., Settembre, G. and Adams, E. (2001) Enhancement of Semiconductor Wafer Cleaning by Chelating Agent Addition. Journal of the Electrochemical Society, 148, G513-G516.
http://dx.doi.org/10.1149/1.1391273

has been cited by the following article:

• TITLE: Slim Water Injection Nozzle for Silicon Wafer Wet Cleaning Bath

  AUTHORS: Shogo Okuyama, Kento Miyazaki, Nobutaka Ono, Hitoshi Habuka, Akihiro Goto

  KEYWORDS: Silicon Wafer, Wet Cleaning Bath, Water Injection Nozzle, Water Flow

  JOURNAL NAME: Advances in Chemical Engineering and Science, Vol.6 No.4, September 12, 2016

  ABSTRACT: In order to effectively and quickly clean the surface of semiconductor silicon wafers, the fluid flow is one of the significant issues. For a batch-type silicon wafer wet cleaning bath, a slim water injection nozzle consisting of a dual tube was studied, based on theoretical calculations and experiments. A thin inner tube was placed at the optimum position in the water injection nozzle. Such a simple design could make the water injection direction normal and the water velocity profile symmetrical along the nozzle. The water flow in the wet cleaning bath was observed using a blue-colored ink tracer. When the nozzle developed in this study was placed at the bottom of the bath, a fast and symmetrical upward water stream was formed between and around the wafers.