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Yoshino, H., Fujii, M., Zhang, X. and Behnia, M. (2003) Numerical Simulation of Conjugate Heat Transfer from Multiple Electronic Module Packages Cooled by Air. IPACK 2003-35144, 331-336. ASME 2003 International Electronic Packaging Technical Conference and Exhibition 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, Maui, 6-11 July 2003.

has been cited by the following article:

• TITLE: Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board

  AUTHORS: Abdullah Alrashidi

  KEYWORDS: Conjugate Heat Transfer, Circuit Board, Numerical Simulation, Mass Flow Rate, 3D Model

  JOURNAL NAME: Journal of Electronics Cooling and Thermal Control, Vol.6 No.3, September 8, 2016

  ABSTRACT: In this paper, a 3D model of a flat circuit board with a heat generating electronic chip mounted on it has been studied numerically. The conjugate heat transfer including the conduction in the chip and convection with the surrounding fluid has been investigated numerically. Computational fluid dynamics using the finite volume method has been used for modeling the conjugate heat transfer through the chip and the circuit board. Conjugate heat transfer has broad applications in engineering and industrial applications in design of cooling off electronic components. Effects of various inlet velocities have been studied on the heat transfer variation and temperature of the circuit board. Numerical results show that the temperature of the chip reduces as the velocity of the inlet fluid flow increases.