Article citationsMore>>

Kim, J., Lee, H. and Kim, J. (2005) Effects on Signal Integrity and Radiated Emission by Split Reference Plane on High-Speed Multilayer Printed Circuit Boards. IEEE Transactions on Advanced Packaging, 28, No. 4.

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top