Article citationsMore>>

T. H. Ho and C. S. Wang, “Modification of Epoxy Resins with Polysiloxane Thermoplastic Polyurethane for Elec-tronic Encapsulation:1,” Polymer, Vol. 37, No. 13, 1996, pp. 2733-2742.

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top