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Minor, A.M. and Morris Jr., J.W. (2000) Growth of a Au-Ni-Sn Intermetallic Compound on the Solder-Substrate Interface after Aging. Metallurgical and Materials Transactions A, 31, 798-800.
http://dx.doi.org/10.1007/s11661-000-0022-5

has been cited by the following article:

• TITLE: Changing the Growth Behavior of a NiSn-Solder Using Gold

  AUTHORS: Mathias Wendt, Andreas Weimar, Marcus Zenger, Klaus Dilger

  KEYWORDS: Lead-Free Solder, Intermetallic Compound Formation, Grain Growth

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.4 No.4, April 28, 2016

  ABSTRACT: In this investigation, the influence of a thin gold (Au) layer on the growth behavior of the intermetallic compound (IMC) in a Nickel-Tin-Solder (NiSn-Solder) was studied. The reaction kinetics was studied in the temperature range of 232℃ to 330℃ using cross-sectional scanning electron microscope (SEM) images. The kinetics of the reaction was determined using the empirical power law and the research showed that the introduction of an Au layer changes the reaction kinetics of the solder significantly. Furthermore, the change in reaction kinetics was accompanied by a change in morphology of the developing grains. The grain morphology of the IMC was studied for samples annealed at 290℃using cross-sectional and top-view samples and compared to Au free NiSn-Solder.